Recently, microelectronics developer Terepac reported that in the next few months, they will begin manufacturing TerreTag, the world's smallest RFID tag for Near Field Communication (NFC). This tag can be accessed through the NFC reader in the user's mobile phone, which can connect the customer with specific product information, or connect an individual with a social networking site, drug data, and other web-based information.
Terepac shows that this passive 13.56 MHz tag was designed using the company's patented assembly method, which is smaller and cheaper than other NFC tags on the market. Therefore, it can be embedded in almost any paper label, product or article.
Located in Waterloo, Ontario, Canada, Terepac was established in 2004 with the goal of tailoring miniaturized electronic products to customers in a variety of vertical markets, including medical services, automotive and transportation. In 2011, for the first time, the company began to work with potential customers with special focus on RFID and NFC technology.
Subsequently, according to Terepac's chief executive Ric Asselsite, Terepac developed a tag that allows its customers to embed their product or product logo regardless of the size of the product, and the company also provides software management from The data read from the tag. The production of such labels will be produced by Terepac's headquarters in Waterloo, or by a smaller site in Dresden, Germany, said Jayna Sheats, chief technology officer at Terepac. She added that this label is also likely to be produced by customers or factories of other company partners.
In order to miniaturize the electronic circuits inside the tags, Terepac uses a patented semiconductor packaging technology and an optoelectronic-based assembly method. Traditional labeling technology usually connects a square chip with a length and width of about 1 mm (0.4 inches) to an antenna. The whole process first needs to place the integrated circuit next to the antenna, and this is accomplished by sucking and placing the chip by the suction of the robotic arm. In this case, a wire or conductive adhesive is needed to connect the chip and the antenna together.
Terepac decided to use a photocopying electronic circuit assembly technology to replace the conventional microelectronics packaging step that was picked up and placed with a robotic arm. Terepac uses a sticky polymer rigid plate that can pick up 1,000 chips at a time. When the rigid board is lifted above the antenna, a beam of light is focused on the polymer on the back of the chip, breaking the polymer into gas. At this point, the chip falls, and the chip is then bound to the antenna by photocopying. In traditional processes, wires and conductive adhesives take up a lot of space, resulting in oversized labels.
In this way, Terepac's label-manufacturing system is 10 to 100 times faster than robot pick-and-place methods, said Thomas Balkons, director of technology integration at the company. “We can provide manufacturing processes that are more productive than any other competitor, but only use the same amount of capital costs. This is where our production cost advantage lies.
In addition, Terepac pointed out that although the current RFID microchip has a length and width of 1 mm, this new assembly method will enable chip makers to create smaller chips as long as 25 micrometers (0.00098 inches) in thickness, 50 micrometers The length and width or smaller. The traditional chip is 500 microns (0.0197 inches) thick. But so far, Asselstine said that chip makers can't simply make smaller chips because existing labeling processes can't adapt.
According to Sheats, some chip makers have expressed interest in such smaller chips. Because, making this smaller chip does not require any changes to the equipment or process. She said, “For them, it's just a matter of design. The change is very simple.†Her company has already negotiated with some chip makers and wireless IC companies, mainly newly established companies. Set about designing microchips. Terepac's cooperation with an original equipment manufacturer to create negotiations is now in its final stages.
Assenlstine claims that the original equipment manufacturer is a global company that offers a variety of microelectronics products, including NFC technology owned by Terepac. He declined to provide details of the product, however, this may be related to the role of the original equipment manufacturing company in the market in the future, or the technology used.
Terepac shows that this passive 13.56 MHz tag was designed using the company's patented assembly method, which is smaller and cheaper than other NFC tags on the market. Therefore, it can be embedded in almost any paper label, product or article.
Located in Waterloo, Ontario, Canada, Terepac was established in 2004 with the goal of tailoring miniaturized electronic products to customers in a variety of vertical markets, including medical services, automotive and transportation. In 2011, for the first time, the company began to work with potential customers with special focus on RFID and NFC technology.
Subsequently, according to Terepac's chief executive Ric Asselsite, Terepac developed a tag that allows its customers to embed their product or product logo regardless of the size of the product, and the company also provides software management from The data read from the tag. The production of such labels will be produced by Terepac's headquarters in Waterloo, or by a smaller site in Dresden, Germany, said Jayna Sheats, chief technology officer at Terepac. She added that this label is also likely to be produced by customers or factories of other company partners.
In order to miniaturize the electronic circuits inside the tags, Terepac uses a patented semiconductor packaging technology and an optoelectronic-based assembly method. Traditional labeling technology usually connects a square chip with a length and width of about 1 mm (0.4 inches) to an antenna. The whole process first needs to place the integrated circuit next to the antenna, and this is accomplished by sucking and placing the chip by the suction of the robotic arm. In this case, a wire or conductive adhesive is needed to connect the chip and the antenna together.
Terepac decided to use a photocopying electronic circuit assembly technology to replace the conventional microelectronics packaging step that was picked up and placed with a robotic arm. Terepac uses a sticky polymer rigid plate that can pick up 1,000 chips at a time. When the rigid board is lifted above the antenna, a beam of light is focused on the polymer on the back of the chip, breaking the polymer into gas. At this point, the chip falls, and the chip is then bound to the antenna by photocopying. In traditional processes, wires and conductive adhesives take up a lot of space, resulting in oversized labels.
In this way, Terepac's label-manufacturing system is 10 to 100 times faster than robot pick-and-place methods, said Thomas Balkons, director of technology integration at the company. “We can provide manufacturing processes that are more productive than any other competitor, but only use the same amount of capital costs. This is where our production cost advantage lies.
In addition, Terepac pointed out that although the current RFID microchip has a length and width of 1 mm, this new assembly method will enable chip makers to create smaller chips as long as 25 micrometers (0.00098 inches) in thickness, 50 micrometers The length and width or smaller. The traditional chip is 500 microns (0.0197 inches) thick. But so far, Asselstine said that chip makers can't simply make smaller chips because existing labeling processes can't adapt.
According to Sheats, some chip makers have expressed interest in such smaller chips. Because, making this smaller chip does not require any changes to the equipment or process. She said, “For them, it's just a matter of design. The change is very simple.†Her company has already negotiated with some chip makers and wireless IC companies, mainly newly established companies. Set about designing microchips. Terepac's cooperation with an original equipment manufacturer to create negotiations is now in its final stages.
Assenlstine claims that the original equipment manufacturer is a global company that offers a variety of microelectronics products, including NFC technology owned by Terepac. He declined to provide details of the product, however, this may be related to the role of the original equipment manufacturing company in the market in the future, or the technology used.
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